Packaging

Packaging is performed at INEX at wafer, discrete device and subsystem integration levels. Bespoke packages can be constructed using our in-house micro-milling capability.

Capability

  • Wafer-level fusion bonding (e.g. silicon-silicon)
  • Wafer-level anodic bonding (e.g. silicon-glass)
  • Eutectic bonding (e.g. metal-metal)
  • Adhesive bonding (e.g. various materials at low temperature)
  • Supercritical CO2 drying
  • Wafer dicing (e.g. glass, silicon and ceramics, III-Vs, etc)
  • Flip-chip bonding (e.g. Pb/Sn and Pb-free MEMS-ASIC or MEMS-CMOS)
  • Die bonding (e.g. die-standard package)
  • Wire bonding (e.g. Al and Au for chip-package interconnect)
  • CNC micromilling for bespoke housing/packaging solutions (e.g. microfluidics and sub-systems)

Equipment

  • EVG 501 wafer bonder
  • Logitech single station wafer bonder
  • Emitech critical point dryer
  • Loadpoint Micro-Ace 3 dicing saw
  • K&S 4123 ball bonder
  • K&S 4523 wedge bonder
  • Karl Suss FC150 flip chip bonder
  • Cammax Precima die bonder
  • Ultron UH114 film frame applicator
  • Datron M9 machining centre

Examples

           


       Adhesive bond using a UV-curable epoxy.                          SnPb solder bumps prior to flip-chip bonding.

                  


   3-axis silicon micromachined gyroscopes triple                       5-parallel flow cell cytometry devices incorporating
stack bonded to glass by wafer level anodic bonding.                                   micro- and millifluidics.