RF and Telecoms
The lower power consumption, lower weight and volume, and lower insertion losses are all key benefits offered by RF-MEMS for defence and civil applications.
RF device development is an ideal area for multiparty collaborative programmes. INEX is always willing to work with clients to build such development partnerships, which share development cost and risk, and minimise eventual production unit cost through higher production volumes associated with multiple applications.
Capabilities that INEX utilizes under its RF-MEMS programme are:
- ANSYS modeling and simulation
- RF-MEMS process flow design
Device fabrication utilises a range of advanced techniques such as HARP, critical point drying, anodic bonding, chemical etching of glass, multi-layer metal deposition, oxynitride thin film deposition and advanced oxide etch.